摘要
为优化覆铜板制作工艺,降低能耗,提高生产效率,在低分子质量环氧树脂(EP-44)与线性酚醛树脂固化体系(EPN)及EP-44/线性酚醛树脂/双氰胺协同固化体系(EPND)中添加双酚A(BPA)扩链,采用示差扫描量热(DSC)法研究了BPA对2种体系固化反应的影响。结果表明,双酚A可小幅提升两种体系的固化特征温度,降低固化反应速率,降低固化产物的玻璃化转变温度(Tg)。双氰胺可降低EPN-BPA体系的固化特征温度,提升反应速率,提高固化产物体系Tg。
In order to optimize the production process of copper clad laminates,reduce energy consumption and improve production efficiency,the bisphenol A(BPA)was added to the low molecular weight epoxy resin(EP-44)and linear phenolic resin curing system(EPN),as well as the EP-44 and synergistic curing system of linear phenolic resin and dicyandiamide(EPND).The effects of BPA on the curing reaction of the two systems were investigated using differential scanning calorimetry(DSC).The results indic ated that BPA could slightly increase the curing characteristic temperature of both systems,reduce the curing reaction rate,and lower the glass transition temperature(T_(g))of the cured products.The dicyandiamide could reduce the curing characteristic temperature of the EPN-BPA system,increase the reaction rate,and increase the T_(g)of the cured product system.
作者
王振镭
李强利
严初三
潘跃武
周浩波
吴强
WANG Zhen-lei;LI Qiang-li;YAN Chu-san;PAN Yue-wu;ZHOU Hao-bo;WU Qiang(College of Chemical and Material Engineering,Zhejiang A&F University,Hangzhou 311300,China;Goldenmax International Technology(Hangzhou)Co.,Ltd.,Hangzhou 311300,China)
出处
《热固性树脂》
CAS
CSCD
2024年第1期20-24,共5页
Thermosetting Resin
基金
浙江省教育厅一般项目(Y202353144)。
关键词
双酚A
环氧树脂
线性酚醛树脂
双氰胺
覆铜板
固化动力学
bisphenol A
epoxy resin
linear phenolic resin
dicyandiamide
copper clad plate
curing kinetics
