摘要
系统级封装(System in Package,Si P)作为新一代的系统小型封装技术,是电子产品小型化和多功能化发展的一个重要方向,并将在包括军事、航天乃至生命科学在内的各领域当中都有广阔的应用前景以及发展空间。本文综述了目前国内外Si P的关键技术研究进展,并对今后面临的挑战与发展趋势进行了讨论。
As the new generation packaging technology, System in Package(Si P) will be a major trend in the development of miniaturization and multifunction of electronic products with bright prospect in the fields such as military, spaceflight and even life science. In this paper, an overview was made about the present researches and developments of key technology of Si P over the world. Furthermore, the challenges Si P confronted with and the future development trend of Si P are discussed.
出处
《微波学报》
CSCD
北大核心
2014年第S1期588-593,共6页
Journal of Microwaves
关键词
系统级封装
小型化
集成技术
发展趋势
电气互连
system in package
miniaturization
integrated technology
development trend
electrical interconnection
