摘要
为了实现射频系统中对电感高品质因子的需求,介绍了一种新型的具有高品质因子的TGV三维电感结构,建立了TGV电感的物理模型,分析了不同结构参数对电感性能的影响,得到电感的品质因数约为80左右。采用这种高品质因子的TGV电感,结合平行平板电容器,设计了一款在玻璃介质中集成的耦合谐振带通滤波器,所设计的滤波器尺寸仅为0.68mm×1.07mm,带内插损小于2dB,面积小,性能优良,进一步验证了电感性能的优良。
In order to realize the demand for high quality factor of inductor in RF system,a new type of TGV three-dimensional inductor structure with high quality factor is introduced. The physical model of TGV inductor is established,and the influence of different structural parameters on inductance performance is analyzed. The quality factor of the inductor is about 80. Using this high quality factor TGV inductor,combined with parallel plate capacitors,a coupled resonant bandpass filter integrated in a glass substrate was designed. The designed filter size is only 0.68 mm ×1.07 mm,the insertion loss is less than 2 dB. The area of filter is small,and the performance is excellent,which further proves the excellent performance of the inductor.
作者
郭燕慧
张国华
王剑峰
GUO Yan-hui;ZHANG Guo-hua;WANG Jian-feng(School of Internet of Things Engineering,Jiangnan University,Wuxi 214122,China;No. 58 Research Institute,China Electronics Technology Group Corporation,Wuxi 214035,China)
出处
《电子设计工程》
2019年第18期97-101,共5页
Electronic Design Engineering
基金
电子基础产品预研资助项目(31513050102)
关键词
玻璃通孔
高品质因子
仿真验证
带通滤波器
TGV(Glass Through Via)
high quality
verification
bandpass filter