摘要
针对某LTCC微波组件,利用有限元热分析方法,获得了微波组件在焊接过程中的温度场和温度曲线;并通过理论计算方法和试验方法共同验证了仿真数据的真实性,证明了微波组件的热力学模型的正确性,为后续研究提供了正确的热力学模型的同时,也对微波组件的焊接工艺优化提供支持。
In this paper,the temperature field and curve of microwave components are obtained by using the FEA. The accuracy of the simulatiaon data is verified by theoretical calculation and experimental methods. The thermodynamic model is also proved to be correct,which would provide support for future research and optimization of welding process of microwave modules.
出处
《机械研究与应用》
2016年第1期149-152,共4页
Mechanical Research & Application
关键词
LTCC
微波组件
热分析
温度曲线
理论计算
试验验证
LTCC
microwave modules
thermal analysis
temperature curve
theoretical calculation
experimental verification
