期刊文献+
任意字段
题名或关键词
题名
关键词
文摘
作者
第一作者
机构
刊名
分类号
参考文献
作者简介
基金资助
栏目信息

集成电路芯片级的热分析方法 被引量：7

The Methods of Chip-level Thermal Analysis of Integrated Circuits
在线阅读 下载PDF
导出
摘要 文章在研究分析了集成电路中功耗的主要来源以及温度对集成电路性能的影响后,详细总结了近年来集成电路芯片级的几种热分析方法,并从实际应用角度对这几种方法进行了分析和比较,讨论了各个方法的优点及其适用范围。 The major sources of power consumption of IC and the temporature-dependent circuit porformance is analyzed. Several methods of chip-level thermal analysis of IC are presented in detail,and all of them are analyzed and compared to each other in light of applications. The advantages and the applications of these methods are discussed.
作者 孙静莹 冯士维 李瑛 杨集 张跃宗
机构地区 北京工业大学电子信息与控制工程学院
出处 《微电子学与计算机》 CSCD 北大核心 2006年第7期86-89,共4页 Microelectronics & Computer
关键词 集成电路 热分析 功耗 Integrated circuits, Thermal analysis, Power consumption
分类号 TN406 [电子电信—微电子学与固体电子学]
  • 相关文献

参考文献19

  • 1Szekely V,Rencz M,Courtois B.Tracing the thermal behavior of ICs[J].IEEE Design & Test of Computers,1998,2(15):14～21
  • 2Schmidt R R.Challengers in chip/processor level thermal engineering[A].2004 Inter Society Conference on Thermal Phenomena[C].2004:738～739
  • 3Yi-Kan Cheng,Sung-Mo Kang.Fast thermal analysis for CMOS VLSIC reliability[A].IEEE Custom Integrated Circuits Conference[C].1996:479～482
  • 4Ting-Yuan Wang,Chen C C P.Thermal-ADI-a lineartime chip-level dynamic thermal-simulation algorithm based on alternating-direction-implicit (ADI) method[J].IEEE Trans.on Very Large Scale Integration (VLSI) Systems,2003,11(4):691～700
  • 5Bougataya M,Lakhsas A,Savaria Y,et al.Mixed fluidheat transfer approach for VLSI steady state thermal analysis[A].Electrical and Computer Engineering,2002[C].Canadian,2002:403～407
  • 6Lee S,A llstotD.Electrothermal simulation of integrated circuits[J].IEEE J Sol Sta Circ,1993,12(28):1283～1293
  • 7Digele G,Lindenkreuz S,Kasper E.Fully coupled dynamic electro-thermal simulation[J],IEEE Trans.On Very Large Scale Integration(VLSi) Systems,1997,5(3):250～257
  • 8Sabry V A M N,Bontemps A,Vahrmann R.Realistic and efficient simulation of electro-thermal effects in VLSI circuits[J].IEEE Trans.on Very Large Scale Integration(VLSI)Systems,1997,5(3):283～89
  • 9Petegem W,Geeraerts B.Electrothermal simulation and design of integrated circuits[J].IEEE J Sol Sta Circ,1994,29(2):143～146
  • 10Swart N R,Nathan A.Coupled electrothermal modeling of microheaters using SPICE[J].IEEE Transactions on Electron Devices,1994,41(6):920～925

二级参考文献16

  • 1Cheng Y，IEEE Trans Computer Aided Design，1998年，17卷，8期，668页
  • 2Chang C Y，ULSI technology，1995年
  • 3Ricardo Gonzalez, Mark Horowitz. Energy Disspation In General Purpose Microprocessor. IEEE Solid State Circuits, Sept 1996,31(9).
  • 4Vivek Tiwari, Deo Sigh, Suresh Rajgopal, et al. Reducing Power in High-performance Microprocessors. the 35th Design Automation Conference, 1998.
  • 5Michael K Gowan, Larry L Biro, Daniel B Jackson. Power Considerations in the Design of the Alpha 21264 Microprocessor, the 35th Design Automation Conference, 1998.
  • 6Richard Fromn, Stylianos Perissakis, Neal Cardwell, et al.The Energy Efficiency of IRAM Architectures. Technical Report, May 1997.
  • 7J Kin, M Gupta and W Mangione Smith. The Filter Cache:An Energy Efficient Memory Structure. IEEE Micro, December 1996.
  • 8Srilatha Manne, Artur Klauser,et al. Pipeline Gating Speculation Control for Energy Reduction. ACM, 1998.
  • 9Michael D Powell, T N Vijaykumar. Pipeline Damping: A Microarchitectural Technique to Reduce Inductive Noise in Supply Voltage. IEEE, 2000.
  • 10Zhenyu Tang, Norman Chang, Shen Lin, et al. Ramp Up/Down Floating Point Unit To Reduce Inductive Noise.IEEE, 2000.

共引文献6

同被引文献61

引证文献7

二级引证文献14

微电子学与计算机
2006年 第7期

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部