摘要
阐述了电子设备热分析重要性并简单介绍了常用热分析软件,利用FLOTHERM软件对一电子设备进行热分析,在此基础上对该电子设备的热控制进行改进设计,通过数值仿真获得满足热控制要求的优化设计参数,以达到工程要求;并将这一模型用FLOTHERM软件进行热分析的结果与用Icepak软件计算结果进行对比,指出两种软件在进行电子设备热设计时的差异。
The importance of the thermal analysis of electronic system is introduced. The technology characteristics of thermal design software are described. Then, the whole process of thermal analysis of some electronic system with FLOTHERM is shown. During the analysis, the thermal control means of the electronic system are improved. By numerical simulation, the optimum design parameter of the fulfilling thermal control requirement can be gained. At the same time, this model proceeds the result of the thermal analysis with the FLOTHERM with the result of the using Icepak calculation proceed contrast, thereby, pointing out the difference of these two kinds of software.
出处
《电子工艺技术》
2006年第5期265-268,共4页
Electronics Process Technology
关键词
热设计
热设计软件
可靠性
电子设备
Thermal design
Thermal design software
Reliability i Electronic device
