摘要
应用基于CFD的热分析软件Flotherm,本文对捷联惯导系统的电子设备进行了热仿真研究,讨论了热分析的方法及理论,分析了仿真模型的建立方法,其中对电路板和电子元器件的建模方法及元器件热功耗的确定方法进行了具体研究。在常温条件下,对电子系统进行了稳态的热仿真,得到了系统的温度场分布,并与温度测试结果进行对比,验证了仿真结果的正确性。研究结果作为惯导系统热仿真的基础,将起到关键的作用。
The paper used the thermal analysis software （Flotherm） based on CFD to thermally simulate the electronic equipment SINS, discussed the method and theory on the thermal analysis and analyzed the simulation modes how to be built. It was carried out in detail that the circuit board, the electric device mode and the hot power consumption were defined. Under the normal temperature, the temperature field of the system how to be distributed was achieved by making thermal simulation on the electric system in steady state. Compared with the measurement result, the validity of the simulation was verified. As the base of the thermal simulation on the SINS, the result in this paper will play a vital role.
出处
《国外电子测量技术》
2007年第4期12-14,共3页
Foreign Electronic Measurement Technology
关键词
电子系统
数值法
热仿真
热测量
惯性导航系统
electronic system
numerical method
thermal simulation
thermal measurement
