摘要
应用有限元数值模拟的方法,建立了电子元件传热的数值模型,并以双列直插元件DIP为例,分析了不同对流换热边界条件下的稳态温度场、影响热点温度的因素及改善热特性的方向。针对电子元件测试的两种典型程序,分析了DIP的热响应性能。以X型电子吊舱为例,对DIP的热点温度进行了数值计算,所获得的瞬态热分析结果对DIP的热设计有重要参考价值。
A numerical model of an electronic component i.e., a DIP, is created using the finite-element method. The steady temperature field of the DIP under different convection boundary conditions is studied, and the key factors influencing the hot-spot temperature and the way to improve the thermal character of the DIP are also studied. According to two typical electronic components testing procedures, the 'real' time thermal response of the DIP was studied. Using model number X avionics pod as a specific case, numerical calculation of the hot-spot temperature of the DIP was carried out, the results obtained have great value for the thermal design of the electronic components.
出处
《电子机械工程》
2005年第1期22-25,28,共5页
Electro-Mechanical Engineering
基金
武器装备预研基金项目(51419020401HK01)
关键词
电子元器件
热分析
温度场
有限元
electronic component
thermal analysis
temperature field
finite-element
