摘要
针对焊接型IGBT模块缺少相应的高海拔地区的电热耦合模型,同时有关高海拔地区由于焊料层缺陷导致芯片失效的研究也少之又少。根据IGBT模块内部电场、热场的耦合作用关系,以焊接型IGBT为研究对象,建立芯片焊料层不同缺陷类型及缺陷比例的高海拔地区焊接型IGBT电热耦合模型,分析了海拔高度以及焊料层空洞、裂纹以及脱落缺陷对焊接型IGBT最大结温的影响,并从机理上做出相应解释,同时提出了高海拔地区焊接型IGBT焊料层缺陷识别模型。研究表明,不同的海拔高度对芯片温度的影响程度不同,高海拔地区芯片温升较低海拔地区明显;不同的缺陷类型、缺陷比例对芯片温度的影响程度也不同,当缺陷比例超过5%后,脱落对芯片温度的影响程度远大于裂纹缺陷和空洞缺陷,同时,所提缺陷识别模型能准确地获取芯片焊料层的缺陷类型和比例,对焊料层的健康状况进行评估。本文研究为高海拔地区焊接型IGBT焊料层健康状态检测,提高IGBT模块运行稳定性提供了理论指导。
For welded IGBT modules,there is no corresponding electro-thermal coupling model at high altitude,and there are few studies on chip failure caused by solder layer defects at high altitude.According to the coupling relationship between electric field and thermal field inside welded IGBT module,the electro-thermal coupling model of welded IGBT module at high altitude with different defect types and defect proportions in the solder layer of chip is established,and the effects of different altitudes,defects of voids,cracks and interface peeling in the solder layer on the maximum junction temperature of welded IGBT module are analyzed.The corresponding mechanism is explained,and the defect identification model of IGBT solder layer in high altitude area is proposed.The results show that different altitudes have different effects on chip temperature,and the chip temperature rises more obviously at high altitudes.When the defect proportion exceeds 5%,the impact of interface peeling on the chip temperature is much greater than that of crack defects and void defects.Meanwhile,the proposed defect identification model can accurately obtain the defect type and proportion of the solder layer of the chip and evaluate the health status of the solder layer.The research provides theoretical guidance for the health state detection of welded IGBT modules’solder layer in high altitude area and improving the operating stability of IGBT module.
作者
王炳强
律方成
张春阳
刘洪春
平措顿珠
刘轩仪
袁成
徐文扣
王平
耿江海
刘云鹏
杜娟
曾俊
次德吉
WANG Bingqiang;LU Fangcheng;ZHANG Chunyang;LIU Hongchun;PING Cuodunzhu;LIU Xuanyi;YUAN Cheng;XU Wenkou;WANG Ping;GENG Jianghai;LIU Yunpeng;DU Juan;ZENG Jun;CI Deji(Hebei Key Laboratory of Power Transmission and Transformation Equipment Safety and Defense(North China Electric Power University),Baoding 071003;Economic and Technology Research Institute of State Grid Tibet Electric Power Co.,Ltd.,Lhasa 850004)
出处
《电气工程学报》
CSCD
北大核心
2024年第3期84-97,共14页
Journal of Electrical Engineering
基金
国家电网有限公司科技资助项目(5500-202237345A-2-0-SY)。
关键词
焊接型IGBT
高海拔
电热耦合
焊料层
状态监测
Welded IGBT module
high altitude
electro-thermal coupling
solder layer
condition monitoring
