摘要
军用电子装备小型化、轻量化的强烈需求,牵引、催生发展出尺寸越来越小的各型连接器,在射频信号传输方面,发展出的SMP(Subminiature Push-on微小型推入式连接器)及SSMP(Small Subminiature Push-on超小型推入式连接器)类微小/超小型连接器得到了较多射频电路设计师的广泛选用。在该类产品研发过程中,器件厂家为了实现更优良的信号传输效果及长期连接可靠性,在已有通孔插装及表面贴装结构形式基础上,设计推出了表面贴装+通孔焊接一体的射频传输链接结构形式。以该类连接器设计采用双面装配形式的需求为牵引,以其装配难点和问题为导向,通过产品特点及问题原因分析,提出满足该类设计需求、解决装配使用过程问题的工艺方法和措施,并完成试验验证及考核确认,总结形成这类连接器高可靠焊接的设计思路和方法,为电子装备小型化的高可靠实现提供了参考和借鉴。
The strong demand for miniaturization and lightweight of military electronic equipment has led to the development of various types of connectors of smaller and smaller sizes.In terms of RF signal transmission,the development of SMP and SSMP class micro connector has been widely used by more RF circuit designers.In the process of research and development of this kind of products,in order to achieve better signal transmission effect and long-term connection reliability,on the basis of existing through hole insertion and surface mount structure,the device manufacturers designed and launched the surface mount+through hole welding integrated RF transmission link structure form.The design of this kind of connector used double-sided assembly requirements as traction,and we took its assembly difficulties and problems as guidance,through the analysis of product characteristics and problem causes,put forward technique and measures to meet the design needs of this kind of design,to solve the problems in the assembly process methods and measures,and completed the test verification and assessment confirmation.We summed up the design ideas and methods of this kind of connector high reliable welding,which provided a reference for the realization of high reliability miniaturization of the electronic equipment.
作者
郑国洪
ZHENG Guohong(China Electronics Technology Group Corporation 10th Research Institute,Chengdu 610036,China)
出处
《新技术新工艺》
2023年第10期6-12,共7页
New Technology & New Process
关键词
小型化
高可靠
SSMP
方法
miniaturization
high reliability
SSMP
method
