摘要
【目的】研究Cu/Sn/Ni焊点在265℃下键合过程中界面金属间化合物的生长趋势及形貌演变。【方法】使用扫描电镜对焊点进行观察和分析。【结果】随着键合时间的增加,界面金属间化合物总厚度不断增加。在Cu-Ni的交互作用下,界面金属间化合物在Cu/Sn和Ni/Sn两侧表现出不同的界面形貌演变和生长速度。在等温回流的四个时间节点中,Cu/Sn侧的金属间化合物生长速率呈先快后慢的趋势,而Ni/Sn侧则为先慢后快。此外,在Cu/Sn/Ni焊点等温回流的四个时间节点中,Cu/Sn侧和Ni/Sn侧金属间化合物的微观形貌存在明显差异。【结论】本研究为深入理解焊点界面金属间化合物的生长规律提供了有价值的参考。
[Purposes]This article aims to investigate the growth trend and morphological evolution of intermetallic compounds(IMCs)at the interface of Cu/Sn/Ni solder joints during the bonding process at 265℃.[Methods]Scanning electron microscopy was used to observe and analyze the solder joints.[Findings]The total thickness of the IMCs at the interface continuously increased with the increase of bonding time.Under the interaction of Cu-Ni,the interface morphology evolution and growth rate of the IMCs on both sides of Cu/Sn and Ni/Sn showed different characteristics.Among the four time points of isothermal reflow,the growth rate of the IMCs on the Cu/Sn side exhibited a trend of fast-slow-fast,while on the Ni/Sn side it was slow-fast-slow.In addition,there were significant differences in the microscopic morphology of the IMCs on the Cu/Sn and Ni/Sn sides at the four time points of isothermal reflow in Cu/Sn/Ni solder joints.[Conclusions]In summary,this study provides valuable reference for a better understanding of the growth law of IMCs at the interface of solder joints.
作者
游飞翔
李五岳
李国俊
田野
YOU Feixiang;LI Wuyue;LI Guojun;TIAN Ye(Henan University of Technology,Zhengzhou 450001,China;Henan Costar Group Co.,Ltd.,Nanyang 473004,China)
出处
《河南科技》
2023年第12期85-88,共4页
Henan Science and Technology
