摘要
该文描述了H20E导电胶粘接工艺优化为先粘接固化再回流焊接工艺流程后过程经过高温冲击,对该工艺流程下环氧胶粘接强度、电气连接可靠性进行验证。通过剪切强度评价、可靠性试验考核、接触电阻测试统计分析、电容粘接界面切面微观金相研究,表明工艺流程优化为先粘接再回流焊接,H20E导电胶粘接工艺满足可靠性需求。
In this paper, the bonding process of H20E conductive adhesive is described. The bonding strength of epoxy adhesive and the reliability of electrical connection are verified under the process of high temperature impact. Through the shear strength evaluation, reliability test assessment, contact resistance test statistical analysis and microscopic metallographic study of capacitance bonding interface section, the results show that the process optimization is bonding first and then reflow soldering, and the bonding process of H20E conductive adhesive meets the reliability requirements.
作者
王腾
朱仁贤
周长健
Wang Teng;Zhu Ren-xian;Zhou Chang-jian(The 43rd Research Institute of CETC,Anhui Heifei 230088)
出处
《电子质量》
2022年第3期37-42,共6页
Electronics Quality
关键词
环氧胶粘接
剪切强度
接触电阻
切面分析
epoxy adhesive
shear strength
contact resistance
section analysis
