摘要
导电胶的粘接可靠性是制约其应用的主要影响因素．针对混合微电路用导电胶粘接的主要失效模式。设计了相应的测试结构和可靠性评价试验，研究了导电胶粘接的机械性能和电性能的退化机制。结果表明试验用导电胶粘接具有较好的耐温变应力性能，其剪切力在3．25～5．35kg之间，结合微观形貌特征分析和理论分析，对导电胶粘接失效机理进行了深入的探讨，并提出了提高导电胶粘接特性的合理方法，最后对目前工艺枢平下的导电胶粘接可靠性进行了相应评价。
Nowadays, Donding reliability of electrically conductive adhesives （ECAs） has become one of the difficulties in its application. Aiming at the ECAs bonding＇ major failure modcs, the accordant test structure and reliability evaluation experiment was developed. Then the mechanical properties and degradation mechanism of electrical properties for ECAs bonding were studied. The result showed that ECAs bonding had a good resistance to temperature dependent stress with a shear force ranging from 3.25 to 5.35 kg. Based on a combination of morphology and theory analysis, the failure mechanism of ECAs bonding was deeply discussed, and then ,some reasonable methods to improve performance of ECAs bonding were presented. Finally ECAs bonding reliability at present technical level was evaluated.
出处
《武汉理工大学学报》
EI
CAS
CSCD
北大核心
2006年第3期18-21,共4页
Journal of Wuhan University of Technology
基金
国家自然科学基金(60371046)
关键词
导电胶粘接
结构与特性
失效机理
ECAs bonding
structure and property
failure mechanism
