摘要
文章分析某新型厚膜混合集成电路进行小批试制时,出现金丝塌陷问题,进而导致产品出现功能异常的情况。试验分析发现,在加工过程、筛选检验过程中因操作不当可造成金丝塌陷。进一步分析发现,产品设计阶段对工艺结构设计,以及加工可操作性考虑欠缺,造成设计不合理,是引起金丝塌陷的主要原因。针对可造成金丝塌陷的原因,提出相关措施,提高产品可靠性。
This paper analyzes a functional abnormality caused by a new thick film Hybrid Integrated Circuit have a problem of gold wire sink when it comes to small-scale trials.It is found that the problme of gold wire sink may due to improper operation in the process of processing and screening.Further analysis shows that lack of consideration in product structure and maneuverability leads to unreasonable design in the designing stage and the unreasonable design is the main cause of gold wire sink.This paper also puts forward relevant measures to improve product reliability.
作者
王柳
夏伟
王洋
Wang Liu;Xia Wei;Wang Yang
出处
《今日自动化》
2021年第7期66-68,共3页
Automation Today
关键词
金丝塌陷
加工异常
筛选检验异常
可靠性
Gold wire sink
Processing Anomaly
Select and examine Anomaly
Reliability
