摘要
金丝键合是多芯片模块微组装的关键工序,概述了统计过程控制用于金丝键合质量的控制研究。主要对金丝键合前键合规范校验的10根金丝键合拉力进行统计分析,得出了金丝键合操作人员与设备间的适应性结论,有助于操作人员提高键合技能和保持稳定的工作状态,优化配置设备和人员,稳定多芯片模块产品微组装的键合质量。
Gold wire -bonding is the key process in muhichip module （MCM） packaging, statistical process control （ SPC ） method used in quality control for gold wire - bonding was studied. By statistical analysis of 10 verifying gold wire bonding forces according to bonding criteria before gold wire - bonding process, the results show that there is an adaptation between bonding operators and equipments, which is helpful for operators improving bonding skill, steady working condition maintenance, equipment and operator optimization, and keeping stable bonding quality of MCM packaging process
出处
《电子工艺技术》
2009年第6期346-348,共3页
Electronics Process Technology
关键词
统计过程控制
键合
多芯片模块
statistical process control
Bonding
multiehip module
