摘要
在PCB板检验过程中,经常发现板上有杂物,这些杂物的出现将导致PCB板的良率下降。从实际案例出发,利用扫描电镜、X-ray能谱分析和显微红外光谱等手段分析PCB杂物的种类及化学结构并提出解决方案,降低杂物缺陷的比例。
In the process of PCB inspection,it is often found that there are contaminants on the board.These contaminants will cause the yield of PCB to decline.Based on actual cases,the types and chemical structures of PCB contaminants have been analyzed by scanning electron microscopy,X-ray energy spectrum analysis and microscopic infrared spectroscopy.The solutions have been done to reduce the proportion of the defects.
作者
付海涛
FU Haitao(Shanghai Meadville Science&Technology Co.,Ltd.,Shanghai 201613,China)
出处
《电子工艺技术》
2020年第5期288-291,共4页
Electronics Process Technology
关键词
PCB
杂物
失效分析
良率
缺陷
PCB
contaminant
failure analysis
yield
defect
