摘要
为获得射频功率模块的低空洞率焊接,分析了真空汽相焊接设备的设备原理、工艺参数设置、工装设计等,对射频功率模块的共晶焊接技术进行了深入研究。结果表明:真空汽相焊接工艺具有加热效率高,温度均匀性好的特点,可实现阶梯式的抽真空操作,能促进Sn63Pb37焊料在熔化时的润湿与铺展,进而实现射频功率模块的低空洞焊接。通过X-ray检测发现,射频功率模块组装件焊透率高达95%以上。
In order to obtain low void soldering of RF powder amplifier module,the equipment principles,process setting and clamp design of vacuum vapor soldering equipment are analyzed,and the eutectic soldering technology of RF power module is studied in depth.The results show that the vacuum vapor soldering has the characteristics of high heating efficiency and stable temperature ability.Meanwhile,with stepwise vacuum applying,the Sn63/Pb37 solder show good wetting ability and achieve low void soldering.X-ray test indicates that the penetration rate of RF amplifier modules is over 95%.
作者
陈柳
郁佳萍
张绍东
张健钢
CHEN Liu;YU Jiaping;ZHANG Shaodong;ZHANG Jiangang(Shanghai Aerospace Electronics Co.,Ltd.,Shanghai 201821 China)
出处
《电子工艺技术》
2020年第4期211-214,共4页
Electronics Process Technology
关键词
射频功率模块
低空洞
真空汽相焊
RF powder amplifier module
low void
vacuum vapor soldering
