摘要
为满足高密度宽带射频封装的要求,微系统产品中广泛采用LTCC基板的BGA封装结构进行平板阵列化集成。基于失效物理的分析方法,分析得出温度循环条件下典型失效模式和适用机理,从材料、结构、工艺等方面展开讨论,并通过故障树分析得出影响BGA互连的可优化因素最小割集,最后采用田口方法进行正交试验设计,对影响BGA板级互连的可优化因素进行优先级排秩,为后续的仿真优化及可靠性提升指引方向。
For the demand of high density broadband RF packaging,the LTCC modules with BGA packaging structure are widely used in microsystem products for board level integration.In the condition of temperature cycle,typical failure mode and internal mechanism are studied by using failure physics method,the minimum cut set of optimizable factors for BGA interconnection are obtained with failure tree analysis from the aspects of substrate materials,BGA structure and process.The orthogonal test designed by using Taguchi method gave the priority order of the infl uencing factors for BGA board level interconnection,which provides guidance for subsequent simulating optimization and reliability improvement.
作者
李阳阳
董东
王辉
卢茜
张继帆
谭继勇
LI Yangyang;DONG Dong;WANG Hui;LU Qian;ZHANG Jifan;TAN Jiyong(The 29th Research Institude of CETC,Chengdu 610036,China)
出处
《电子工艺技术》
2020年第2期71-75,98,共6页
Electronics Process Technology
基金
装备发展科研合同项目(182ZDK31007)。
