摘要
研究了化学镀钯液的配位剂和稳定剂对镀液稳定性和镀速的影响,得到适合印制线路板化学镀镍/钯/金工艺的化学镀钯液配方:Pd(NH3)4SO4 0.005 mol/L,NaH2PO2·H2O0.01 mol/L,有机胺A0.1 mol/L,甘氨酸0.015 mol/L,不饱和有机酸B 0.3 mol/L,金属盐稳定剂C1mg/L。该镀液稳定,在pH为7.2、温度为50°C的条件下的平均镀速为0.010~0.013μm/min,施镀15 min所得钯层表面平整、致密,令产品具有良好的金线键合能力。
The effects of complexant and stabilizer on the stability and deposition rate of electroless palladium plating bath were studied. The composition of electroless palladium plating bath suitable for manufacturing ENEPIG(electroless nickel/electroless palladium/immersion gold) printed circuit boards(PCBs) was obtained as follows: Pd(NH3)4 SO4 0.005 mol/L, NaH2PO2·H2O0.01 mol/L, organic amine A 0.1 mol/L, glycine 0.015 mol/L, unsaturated organic acid B0.3 mol/L, and metal salt stabilizer C1 mg/L. The bath has an average deposition rate of 0.010-0.013 μm/min at temperature 50 °C and pH 7.2. The palladium layers formed by plating for 15 min are smooth and compact, facilicating the gold wire bonding on PCBs.
作者
赵超
陈伟
刘光明
江德馨
文明立
彭小英
ZHAO Chao;CHEN Wei;LIU Guang-ming;JIANG De-xin;WEN Ming-li;PENG Xiao-ying(School of Materials Science and Engineering,Nanchang Hangkong University,Nanchang 330063,China)
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2019年第24期1315-1319,共5页
Electroplating & Finishing
关键词
化学镀
镍
钯
金
镀液稳定性
镀速
金线键合
electroless plating
nickel
palladium
gold
bath stability
deposition rate
gold wire bonding
