摘要
刚挠结合印制板综合了刚性板和挠性板各自的优点,在电子电路技术中得到了广泛的应用。其工艺实现上主要的关键技术是材料匹配技术、多层板层间对位技术、层间互连技术以及软板区防损技术。
Rigid-flex Printed Circuit Board, which incorporates the merits of rigid PCB and flexible PCB, It is widely used in electronic circuit technology. The key technologies of the Rigid-flex PCB process are material matching technology, multi-layer alignment technology, interconnection technology and prevention of damage technology in flex area.
作者
穆敦发
王盘
Mu Dunfa;Wang Pan
出处
《印制电路信息》
2018年第9期58-63,共6页
Printed Circuit Information
关键词
刚挠结合板
材料匹配
层间对位
层间互连
Rigid–Flex PCB
Material Matching
Multi-Layer Alignment
Interconnection
