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刚挠印制板技术在军用传感器中的应用 被引量:3

Applications of flexible-rigid PCB technology in military sensor
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摘要 将刚挠结合印制板的设计理念引入到航天产品的电路板结构设计中,四块刚性印制板和三块挠性板进行一体化设计,实现了接口的高可靠性连接,并极大地节省了传感器的内部空间,便于传感器微型化。刚性印制板采用四层板设计,挠性板采用双层板设计,实现了小电路板上含有多种信号通道的目的。通过振动试验、加速度试验、冲击试验、高低温循环试验等试验证明了高可靠性刚挠印制板可以应用于航天器等军用型号。 The idea of flexible-rigid PCB is introduced into structure design of circuit board for aerospace products. Integrating four rigid boards with three flexible boards realizes high reliable connect of interface and infinitely saves inner space of the sensor and convenient for miniazation of sensor. The design of four-layered rigid boards and double-layered flexible board implements that small circuit board can include multichannel of signal.Through vibration test,acceleration test,shock test,thermal cycle test,It is proved that the high reliability flexiblerigid PCB can be applied to military products such as aerospace.
出处 《传感器与微系统》 CSCD 2016年第10期155-157,160,共4页 Transducer and Microsystem Technologies
关键词 刚挠结合印制板 传感器 四层板 航天器 flexible-rigid PCB sensor four-layered board aerospace product
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参考文献5

  • 1Jong E C W de, Ferreira J A, Bauer P. 3D integration with PCB technology [ C ]//The 21st Annum IEEE Applied Power Electron- ics Conference and Exposition, Dallas ,2006:857 -863.
  • 2Lang K D, Wolf M J, Thomasius R, et al. Assembly and integra- tion technologies for miniaturized sensor systems[ C ]//The 13th International Conference on Sensor, Germany ,2007:187 --192.
  • 3Lars Martin. Evolution of a wiring concept:30 years of flex-rigid circuit board production [ J ]. Circuitree,2006,11:22 -94.
  • 4原稔.刚挠印制线路板[J].电子实装技术,2006,22(3):55-57.
  • 5陈长生.提高刚挠结合多层印制板的可靠性[c]∥第六届全国印制电路学术年会论文汇编,中国电子学会生产技术学分会印制电路专委会,2000:237-241.

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