摘要
抛光液pH值对镁铝尖晶石的材料去除率和表面质量具有重要作用。采用不同pH值的抛光液对尖晶石样品进行研磨加工并测量其去除率和表面粗糙度,评价pH值对尖晶石化学机械抛光效果的影响。配制多种pH值抛光液,在转速为80 r/min和100 r/min的条件下开展两组化学机械抛光实验研究。采用失重法测量材料去除率;采用粗糙度仪测量尖晶石表面微观形貌,分析pH值和转速对抛光效果的影响规律,探索尖晶石材料的化学机械抛光机理。结果表明:加酸或加碱能有效提高材料去除率且降低表面粗糙度,但碱性介质帮助更大;抛光盘转速越高,尖晶石材料去除率和表面粗糙度也将增加,选择合适的抛光速度也是必要的。该研究成果将为进一步研究镁铝尖晶石化学机械抛光机理奠定实验基础。
Chemical effect of polishing slurry and rotational speed are very important for Material Removal Rate （MRR） and surface quality during polishing. Under different rotational speed, the slurries with different pH were used for the analysis of spinel wafers lapping, and the effects of pH slurries on MRR and surface quality were explored. Through making the slurries with different pH, both groups of experiments were carried out of chemical mechanical polishing （CMP） at the speeds of 80 r/min and 100 r/min. The MRRs of spinel were measured using the lost weight analysis law, and the surface roughness was checked with a roughness instrument. They were used to analyze the effects of pH and rotational speed on lapping accuracy, and were also used to explore the mechanism of CMP. The results show that the MRRs increase with the rising of acid or alkaline, and that their roughness decreases instead. Of them, alkaline slurries have a greater effect on MRR and roughness. With the increase of rotational speed, MRR and surface roughness can also be increased obviously. A suitable speed should be considered carefully. The study will lay an experimental foundation for exploring further the chemical mechanical polishing mechanism.
出处
《红外与激光工程》
EI
CSCD
北大核心
2017年第B12期125-130,共6页
Infrared and Laser Engineering
基金
国家自然科学基金(51675497)
河南省高等学校重点科研项目(16A413006)
北京市自然科学基金(3162034)
关键词
超精密加工
表面质量
PH值
化学机械抛光
镁铝尖晶石
ultra-precision machining
surface quality
pH value
chemical mechanical polishing
magnesia-alumina spinel
