摘要
基于ABAQUS软件,对不同结构参数下QFP封装的随机振动响应进行了分析,获取了整体封装结构及焊点阵列的应力分布云图,并研究了引线宽度、引线间距、引线高度等不同参数对QFP封装器件应力场的影响规律.结果表明,在随机振动载荷下,QFP封装器件的焊点阵列为整体结构的薄弱环节,且最大应力位置出现在焊趾部位,即焊点最外侧的尖角处;在焊点的焊趾部位以及引线与焊点交界处存在明显的应力集中现象,上述两处将成为焊点最可能发生破坏的区域;QFP封装器件的最大应力值与引线间距和引线高度成正比,与引线宽度成反比.
Random vibration responses of QFP with different structure parameters were analyzed based on the ABAQUS software. The stress distributions of whole packaging and solder joints were obtained. The influence regularities of different lead widths,lead distances and lead heights on the stress field of QFP have been studied. The results indicate that,under the random vibration loading,the solder joints are weak components of QFP.The maximum stress focuses on the sharp corner of exterior part of the solder joints. Stress concentration areas locate at that position and the junction of lead with solder joint,which will be the most likely failure regions. The maximum stress of QFP is in direct proportion to the distance and height of lead and in inverse proportion to the width of lead.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2015年第11期21-24,114,共4页
Transactions of The China Welding Institution
基金
国家自然科学基金资助项目(51305268)
上海市自然科学基金资助项目(15ZR1428200)
关键词
随机振动
四边扁平封装
影响规律
焊点
random vibration
quad flat packaging
influence regularities
solder joint
