摘要
重点介绍了以聚酰亚胺作为介质层的钝化工艺流程。聚酰亚胺具有突出的耐热性能、优异的机械性能和优良的电性能,依据聚酰亚胺的材料特性,制定备片、涂胶、光刻等工艺流程,并在生产线上进行工艺流片,通过试验验证,取得了良好效果,证明了以该材料作为钝化层可以大幅度缩减工艺流程,降低科研生产成本。
This paper introduces the technology of passivation by polyimide which has outstanding properties of heat resistance, machinery and electricity. According to the material properties of polyimide, the process flow such as wafer preparing, gluing and lithography, etc. are developed. The experimental results show that the polyimide is a good material of passivation for reducing production procedure and cost.
出处
《微处理机》
2015年第5期9-11,共3页
Microprocessors
关键词
聚酰亚胺
性能
钝化工艺
Polyimide
Property
Technology of passivation
