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基于有限元法的固体绝缘开关柜温度场仿真研究 被引量:17

Simulation Study on Temperature Field of Solid Insulated Switchgear Based on Finite Element Method
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摘要 由于固体绝缘材料低热传导系数的特点,以往的固体绝缘开关很难实现大电流参数设计,无法满足高负荷密度场合应用,使得该类产品进一步推广、应用受到阻碍。文中首先建立简单三相母线模型,运用流体仿真计算软件得到了一种固体绝缘开关柜的温度场仿真方法,再运用该方法对某12 k V固体绝缘开关柜的三维模型进行温度场仿真,得出了该型开关柜的温度分布。通过对比实际样机温升试验结果,验证了所设计仿真方法的有效性。 Due to the characteristics of low heat conduction coefficient of solid insulated materials,it is difficult to design large current parameters for solid insulated switchgear in the past,and unable to meet the application of high load occasion.This makes the further promotion and application of such products hindered.To overcome the difficulty,a simple three phase busbar model is established.Using fluid simulation software,a temperature field simulation method suitable for R&D of large current solid insulated switchgear is obtained.Then using this method,the temperature field diagram of a 12 kV solid insulated switchgear is obtained.The effectiveness of the designed simulation method is verified by comparing the temperature rise of the prototype.
作者 张凯 陈丽安 黄留留 ZHANG Kai;CHEN Li'an;HUANG Liuliu(School of Electric Engineering and Automation,Xiamen University of Technology,Fujian Xiamen 361024,China;I-SEER&D International Co.,Ltd.,Fujian Xiamen 361006,China)
出处 《高压电器》 CAS CSCD 北大核心 2018年第12期76-81,共6页 High Voltage Apparatus
关键词 有限元 中压开关柜 固体绝缘 温度场 finite element medium voltage switchgear solid insulated temperature field
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