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钝化2-乙基-4-甲基咪唑/环氧树脂低温固化体系研究 被引量:1

Study on low temperature curing systems for epoxy resin cured by passivating 2,4-EMI
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摘要 测定了三种α-甲基丙烯酸钝化2-乙基-4-甲基咪唑固化环氧树脂(EP)体系的凝胶时间及固化反应放热曲线,制定了EP固化体系的固化工艺条件,并对这三种EP固化体系的室温(20℃)储存特性及其浇铸体的综合性能进行了比较。结果表明:这三种EP固化体系均可在80℃时快速固化,浇铸体的固化工艺条件为80℃/4 h;当m(E-51)∶m(Eg-031)∶m(固化剂)=25∶25∶2时,EP固化体系预浸料具有最长的储存期(15 d),是综合性能优良的低成本复合材料制造用基体树脂,其弯曲强度、弯曲模量、冲击强度和热变形温度分别为109.3 MPa、3.0 GPa、7.76 kJ/m2和125℃。 The gelling time and exothermic curve of curing reaction were mensurated, and curing process condition was constituted for three kinds of different curing systems based on epoxy resin (EP) cured by α-methyl acrylic aeid passivation 2-ethyl-4-methylimidazole(2,4-EMI). The storage period at room temperature(20 ℃) of three kinds of EP curing systems and the combination property of the corresponding castings were compared. The results showed that the three kinds of EP curing systems could be quickly cured at 80 ℃, and the curing proeess conditions of the castings were 80 ℃ and 4 h. The EP curing system prepreg had the longest storage period for 15 days, and it could be used as matrix resin of lower cost preparing composite with well combination property because bending strength, flexural modulus, impact strength and heat distortion temperature of the corresponding casting were 109.3 MPa, 3.0 GPa, 7.76 kJ/m^2 and 125 ℃ respectively when mass ratio of re(E-51 ):m(Eg-031 ):re(curing agent) was 25:25:2.
出处 《中国胶粘剂》 CAS 北大核心 2010年第6期11-14,共4页 China Adhesives
关键词 2-乙基-4-甲基咪唑 环氧树脂 低温固化体系 高性能 2,4-EMI epoxy resin low temperature curing system high performance
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