摘要
为得到一种高强度的室温固化耐热胶黏剂,用笼型r-氨丙基倍半硅氧烷(PAPSS)和低分子聚酰胺(PA)作固化剂加入活性稀释剂、促进剂、硅烷偶联剂等辅助材料,制备了室温固化双酚-A型环氧树脂胶黏剂,研究了胶黏剂粘接强度、耐热、耐老化等性能。结果表明,该胶黏剂常温固化8h剪切强度可达到20 MPa以上,200℃条件下烘箱中静置72h,保持率在98%以上,热分解温度为376℃。该胶黏剂是一种常温固化、热稳定性好、耐高温、黏度低的优良结构胶黏剂。
In order to obtain a kind of adhesive curing at room temperature with higher strength and heat resistance, a bisphenol - A epoxy resin was prepared with the polyhedral γ - amino - propyl silsesquioxanes （PAPSS） and low molecular polyamide （PA） as curing agents, adding reactive diluent, accelerant, silane coupling agent and etc. The bonding strength, heat and aging resistance of this adhesive were studied. The results showed that the adhesive was an excellent structure adhesive with good thermal stability and low viscosity whose shear strength was over 20MP after curing 8 hours at room temperature. Its thermal decomposition temperature was 376℃, and the retaining rate of adhesive strength was over 98% after placed in oven for 72h at 200℃.
出处
《化学与粘合》
CAS
2007年第5期319-322,共4页
Chemistry and Adhesion
基金
河北省自然科学基金项目(200700204)
