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室温固化耐热环氧胶粘剂的研究进展与发展趋势 被引量:5

Research progress and development trend of epoxy resin adhesives with room temperature curing and heat resistance
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摘要 综述了室温固化耐热环氧树脂(EP)胶粘剂的研究进展与发展趋势,介绍了近年来国内外部分性能优异的室温固化耐热EP胶粘剂,指出室温固化耐热EP胶粘剂的发展趋势是耐高温、高强度、高耐久性及快速固化。 The research progress and development trend of epoxy resin(EP) adhesives with room temperature curing and heat resistance were summarized.Some EP adhesives with excellent performances were introduced at home and abroad.It is indicated that the development trend for EP adhesive with room temperature curing and heat resistance is high temperature resistance,high strength,high endured and fast curing.
出处 《中国胶粘剂》 CAS 北大核心 2009年第11期57-62,共6页 China Adhesives
关键词 室温固化 耐热 环氧树脂 结构胶 room temperature curing heat resistance epoxy resin structural adhesive
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参考文献26

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