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Effect of ultrasonic power on wedge bonding strength and interface microstructure 被引量：2

Effect of ultrasonic power on wedge bonding strength and interface microstructure
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摘要 During the aluminum wire wedge bonding, the ultrasonic power and bonding strength were obtained. Based on those data, the relationship between ultrasonic power and bonding strength was studied. The results show that: 1) ultrasonic power is affected by ultrasonic power ratio and other uncontrolled factors such as asymmetric substrate quality, unstable restriction on the interface between wedge tool and aluminum wire; 2) when ultrasonic power is less than 1.0 W, increasing ultrasonic power leads to increasing bonding strength and decreasing failure bonding; on the contrary, when ultrasonic power is greater than 1.6 W, increasing power leads to decreasing bonding strength and increasing failure bonding; 3) only when ultrasonic power is between 1.0 W and 1.6 W, can stable and high yield bonding be reached. Finally, the microstructure of bonding interface was observed, and a ring-shaped bond pattern is founded in the center and friction scrape besides the ring area. During the aluminum wire wedge bonding, the ultrasonic power and bonding strength were obtained. Based on those data, the relationship between ultrasonic power and bonding strength was studied. The results show that： 1） ultrasonic power is affected by ultrasonic power ratio and other uncontrolled factors such as asymmetric substrate quality, unstable restriction on the interface between wedge tool and aluminum wire; 2） when ultrasonic power is less than 1.0 W, increasing ultrasonic power leads to increasing bonding strength and decreasing failure bonding; on the contrary, when ultrasonic power is greater than 1.6 W, increasing power leads to decreasing bonding strength and increasing failure bonding; 3） only when ultrasonic power is between 1.0 W and 1.6 W, can stable and high yield bonding be reached. Finally, the microstructure of bonding interface was observed, and a ring-shaped bond pattern is founded in the center and friction scrape besides the ring area.
作者 王福亮 李军辉 韩雷 钟掘
机构地区 School of Mechanical and Electrical Engineering
出处 《中国有色金属学会会刊：英文版》 EI CSCD 2007年第3期606-611,共6页 Transactions of Nonferrous Metals Society of China
基金 Projects(50390064, 50675227) supported by the National Natural Science Foundation of China Project(2003CB716202) supported by the National Basic Research Program of China
关键词 焊接强度 超声波技术 显微结构 焊接技术 bonding strength ultrasonic power wedge bonding microstructure
分类号 TB559 [理学—声学]
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参考文献16

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二级参考文献15

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共引文献25

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中国有色金属学会会刊：英文版
2007年 第3期

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