摘要
以金属共沉积理论为依据,对Cu2+、Ni2+共沉积进行计算,结果发现,理论计算值与实际工艺参数值之间存在极大差异。表明在化学沉积Ni Cu P合金过程中,由于Ni2+的重要作用———诱导在活性表面上放电及维持表面活性,使得Cu2+、Ni2+的共沉积不同于一般阴电极上金属共沉。
According to the theory of metal co-sediment, the paper does a calculation on the co-sediment of Cu^(2+)and Ni^(2+) and shows that there is a big difference between academic value and actual technique parameter value. It shows, in the process of Ni-Cu-P alloy chemical plating, that co-sediment of Cu^(2+)and Ni^(2+) is different from that on the common cathode pole by means of the importance of Ni^(2+)——inducing (H_2PO_2)^- to discharge on the active surface and keeping the activity of surface.
出处
《表面技术》
EI
CAS
CSCD
北大核心
2004年第2期29-31,35,共4页
Surface Technology
基金
中国工程物理研究院基金资助项目(42101080410)
