摘要
芯片级封装(简称'CSP')器件凭借着微型化、出光品质高而备受青睐,各国LED企业纷纷加大研发力度及知识产权布局保护。本文采用专利技术功效图的分析方法,对中国和美国CSP LED器件的专利技术发展现状展开研究,并对国外主流厂商韩国三星、首尔半导体、飞利浦Lumileds、日亚等公司的CSP LED器件专利进行剖析,比较各家大厂CSP LED器件的技术路线,从而分析出CSP LED专利技术的雷区与技术空白点,以便于指导国内LED企业在CSP LED器件专利的布局,尤其应着重于应用领域的外围专利申请,可通过广撒网的专利申请方式增加与国外LED龙头企业的竞争筹码。
Chip Scale Package(CSP)devices have been attractive recently,due to their miniaturization and high light quality.Therefore,LED enterprises in various countries have put increased effort in products research and development together with intellectual property.This paper aims to study the patent technology development status of China and America by analyzing technology-effect diagram.Technology minefields and technology gaps are obtained by analyzing the CSP LED devices patents and technical roadmaps of foreign main manufacturers such as Samsung,Seoul Semiconductor,Philips Lumileds,Nichia and others.In order to increase the competition in CSP LED field,it is suggested that the domestic LED enterprises can use the methods of expanding the layout of patent applications and strengthening peripheral patent applications in application area.
作者
袁毅凯
李丹伟
梁丽芳
李程
YUAN Yikai;LI Danwei;LIANG Lifang;LI Cheng(Foshan Nationstar Optoelectronics Co.,Ltd.,Foshan 528000,China)
出处
《中国照明电器》
2019年第5期1-10,共10页
China Light & Lighting
基金
广东省各类创新中心高质量专利培育项目“半导体照明领域知识产权提质增量项目”(粤知产合同(2018)11号-24)
