摘要
目的:为实现柔性精细铜引线,通过配制Cu/ITO双膜系蚀刻液并对其蚀刻工艺进行研究,得到蚀刻液的合理配比和最佳的工艺参数。方法:通过配制的蚀刻液进行分析,测试其对Cu膜的蚀刻程度,通过对蚀刻温度、喷淋压力、蚀刻时间、药液浓度等工艺参数进行调整控制,利用蚀刻液的高选择性,使Cu/ITO双膜系刻蚀一步完成图案化。结果:通过试验得到Cu/ITO双膜系蚀刻液的合理配比和最佳的工艺参数,进行批量化试验生产得到线宽线距L/S规格为(35±5)μm的产品,生产的Cu-Film Sensor在外观及功能测试方面可达到规格要求,金属铜线路边缘整齐美观,绝缘性在50 MΩ以上,蚀刻后膜层附着力达到5B,产品高温高湿可靠性均符合规格要求,制程C pK大于1.33。意义:该工艺整个过程操作简练、安全环保而且配制的药液体系更加均匀稳定,可进行批量化稳定生产。
Objective:In order to realize the flexible meticulous copper lead,the paper prepared the etching solution and studied the etching process.The reasonable ratio of the etching solution and the optimal process parameters were obtained.Methods:analyze the prepared etching solution,test the etching degree of Cu film,adjust the process parameters such as etching temperature,spray pressure,etching time and liquid concentration.Using the high selectivity of the etch fluid,the Cu/ITO double-membrane system etching was patterned in one step.Results:Through the test,and the best process parameters,the L/S is(35±5)μm.The Cu-Film Sensor can meet the specification requirements in terms of appearance and function test,the metal copper line edge is neat and beautiful,the insulation is above 50 MΩ,the adhesion of the membrane layer reaches 5B after etching,the reliability of high temperature and high humidity meets the specifications,and the C pK of the process is greater than 1.33.Significance:The whole process of the process is concise,safe and environmentally friendly,and the prepared liquid system is more uniform and stable,which can be mass production.
作者
吕志明
Lyu Zhiming(Yichang Nanbo Display Devices Co.,Ltd.,Yichang 443000,China)
出处
《山东化工》
CAS
2024年第9期23-27,32,共6页
Shandong Chemical Industry
关键词
精细铜引
Cu/ITO双膜系
蚀刻液
图案化
meticulous copper lead wire
Cu/ITO double membrane series
etching liquid
patterned
