摘要
为了实现夹持状态下晶片旋转,减少生产过程中夹持次数,降低因多次夹持对晶圆表面损伤的可能,提高生产效率,提出一种利用空气动力学原理的晶圆夹持方法。在柱形半密闭空间内以特定位置、特定角度通入高压气体,产生局部真空区域,通过晶柱形空间产生的负压力实现吸附。对空间内的气流进行理论分析,选取双入口、入口与壁面相切的进气方式,建立单个半封闭空间吸取模型,并利用Relizable k-ε湍流模型对气流流动状况、压力分布等进行数值模拟。分析了稳定状态下,晶圆与叉手上端面距离对晶圆受力的影响,为生产中叉手实际吸取晶圆提供理论依据。
In order to realize the wafer rotation in the clamping state,reduce the clamping times in the production process,reduce the possibility of wafer surface damage due to multiple clamping,and improve the production efficiency,a wafer clamping method based on the principle of aerodynamics is proposed.Local vacuum area is generated by passing high-pressure gas into the cylindrical semi confined space at a specific position and angle.The wafer adsorbs through the negative pressure generated by the cylindrical space.The theoretical analysis of air flow in the space is carried out,and the intake mode of double inlets and inlets tangent to the wall is selected to establish a single semi enclosed space absorption model,and the"Realizable"k-εTurbulence model is used to simulate the flow condition and pressure distribution.The influence of the distance between the wafer and the upper end of the fork on the wafer stress under stable conditions is analyzed,which provides a theoretical basis for the fork to actually absorb the wafer in production.
作者
杨铁聪
于大泳
YANG Tiecong;YU Dayong(School of Mechanical Engineering,University of Shanghai for Science and Technology,Shanghai 200093,China)
出处
《农业装备与车辆工程》
2023年第6期50-53,共4页
Agricultural Equipment & Vehicle Engineering
