摘要
W_(45)Cu_(55),Cr_(65)Cu_(35),and Cr_(32)W_(14)Cu_(54)alloys were obtained in order to study the mechanism of“smart response”of the structure of these alloys when using them as arc-resistant circuit-breakers.These alloys differ from industrial ones with frameless packing of Cr and W phases in the copper matrix.The alloy production method is based on the infiltration of copper melt into a mixture of non-compacted Cr and W powders under vibration exposure(80 Hz).The research results show an increase in the arc resistance of contacts when changing from“frame”packing of W to“frameless,”as well as the decisive role of Cr in the processes of self-dispersion of arc-resistant phases and passivation of W and Cu.Based on the obtained results,conclusions are drawn about the advantage of frameless packing of arc-resistant phases in copper and the reasons for the“smart behavior”of the structure of Cr-containing contacts in response to functional loads in the presence of oxygen and an inert atmosphere.
为了研究抗电弧断路器合金显微组织的智能响应机制,制备W_(45)Cu_(55)、Cr_(65)Cu_(35)和Cr_(32)W_(14)Cu_(54)合金。与工业合金不同,这些合金中Cr和W相是无骨架填充到铜基体中。其制备方法是在振动(80 Hz)下,将铜熔体渗透到未压实的Cr和W混合粉末中。结果显示,当W由“骨架”填充变为“无骨架”填充后,触头的抗弧性能有所提高,Cr对抗弧相的自扩散和W、Cu钝化过程起决定性作用。基于所得结果,总结铜中无骨架填充抗电弧相的优点,以及含Cr触头显微组织在含氧和惰性气氛下对功能载荷响应时“智能行为”的原因。
