摘要
随着多数产品更高的I/O数需求,微铜柱凸点已经成为倒装芯片领域的主流,而热压倒装焊则是目前使用最多的键合方式之一。针对一款Cu-Sn-Cu倒装芯片,基于日本Athlete公司的CB-600低荷重半自动倒装键合机,以研究芯片键合质量为目标,完成了不同参数条件下的芯片键合样品,并通过光学显微镜和拉剪力测试机对样品的键合质量进行了比较,得到了键合参数对键合质量的影响规律。
With the increasing demand of more I/O in most products,micro copper pillar solder bump has become the mainstream of flip chip field,and thermal compression bonding is one of the most widely used bonding methods.This paper focuses on Cu-Sn-Cu flip chip,and aims at the quality of chip bonding,the samples with different parameters are completed by using CB-600 of Athlete in Japan.The bonding quality of the samples is compared by optical microscope and tensile shear tester,and the influence of bonding parameters on bonding quality is obtained.
作者
张潇睿
ZHANG Xiaorui(Aviation Engineering College,Civil Aviation Flight University of China,Guanghan 618307,China)
出处
《电子与封装》
2021年第9期20-24,共5页
Electronics & Packaging
关键词
微铜柱凸点
热压键合
键合参数
拉剪力测试
micro copper pillar solder bump
thermal compression bonding
bonding parameters
tensile shear test
