摘要
基于定偏心平面研磨方式,提出了无理转速比下的偏摆式平面研磨方式。采用矢量方法建立了偏摆式平面研磨加工的运动学方程,对比分析了定偏心和偏摆式驱动下的工件表面磨粒轨迹和磨粒速度场的分布形态,并建立了运动轨迹密度均匀性和材料去除量均匀性的区域划分和统计评价方法。研究表明:偏摆式驱动下的平面研磨轨迹线更加复杂无序,磨粒覆盖面积更大,能更快地获得更均匀的轨迹线分布,且在无理转速比下无明显牛顿环现象,轨迹线的均匀性显著提高;相同转速比时两种驱动方式下磨粒速度场分布形态类型相同,但偏摆式下单颗磨粒的速度大小和速度方向角随时间变化均无明显周期,能获得的速度大于定偏心方式,更快地实现材料去除且无理转速比下的材料去除性更为均匀。最后搭建两种驱动方式的试验平台进行研磨对比试验,通过无理偏摆式加工方式后硅片获得的表面粗糙度Ra最低,且相同时间内的材料去除量最大。
New swing plane lapping method with irrational speed ratio is proposed based on the certain eccentric plane lapping method.Kinematic analysis of swing plane lapping is established by vector method.Trajectory of abrasive particles and the distribution of velocity field on the workpiece surface driven by fixed eccentricity and swinging are simulated,then uniformity of the density of motion trajectory and material removal rate are evaluated by micro unit and statistical methods.Results show that the trajectory of the swinging plane lapping is more complex,and the area covered by abrasive particles is larger.There is no obvious Newton ring phenomenon under irrational speed ratio,and more uniform trajectory distribution can be obtained faster.Uniformity of the trajectory is significantly improved by using the irrational speed.Distribution pattern of abrasive velocity field under the two driving modes is the same under the same speed ratio.There is no obvious period when the velocity and velocity direction angle of single abrasive was changed under the swing mode,and the speed obtained is faster than that under the certain eccentricity type,and material removal can be achieved faster and more uniformity under the irrational speed ratio.Finally,the experimental platform of two driving methods was built for the comparative lapping experiment.The surface roughness Ra of the silicon chip obtained by the irrational swinging Lapping method is the lowest,and the material removal is the largest within the same time.
作者
肖燏婷
吴晓峰
蔡姚杰
文东辉
XIAO Yuting;WU Xiaofeng;CAI Yaojie;WEN Donghui(Key Laboratory of Special Purpose Equipment and Advanced Processing Technology of Ministry of Education,Zhejiang University of Technology,Hangzhou 310023;Zhejiang MTCN Technology Co.LTD.,Huzhou 313100)
出处
《机械工程学报》
EI
CAS
CSCD
北大核心
2021年第13期232-241,共10页
Journal of Mechanical Engineering
基金
国家自然科学基金(51775509)
浙江省自然科学基金重点(LZ17E050003)资助项目。
关键词
运动分析
研磨均匀性
偏心距
速度场
材料去除
kinematic analysis
lapping uniformity
eccentricity
velocity field
material removal
