摘要
采用氢氧化钾(KOH)溶液对对位芳纶进行表面预处理,以硝酸银(AgNO 3)和氨水制备银氨溶液作为施镀液,利用化学镀银法制备金属化对位芳纶,研究了AgNO 3浓度和施镀时间对金属化对位芳纶的镀层形貌、导电性能及力学性能的影响,同时探讨了化学镀银过程中对位芳纶表面银(Ag)的沉积动力学过程。结果表明:通过单一变量法实验,化学施镀温度为50℃、AgNO 3浓度为0.5 g/L、施镀时间为50 min时,镀银效果好,制备的金属化对位芳纶具有良好的导电性能和力学性能;金属化对位芳纶表面的Ag层分布均匀、Ag晶粒尺寸为21.04 nm,纤维表面电阻达1.5Ω/cm、断裂强度为18.9 cN/dtex、断裂伸长率为3.9%,断裂强度比原丝仅下降8.3%,不影响纤维的使用性能;随着施镀时间的增加,金属化对位芳纶表面Ag的沉积速率显著降低、增重率逐步增加。
The surface of p-aramid fiber was pretreated with potassium hydroxide(KOH)solution and a metallized p-aramid fiber was prepared by electroless silver plating using silver ammonia solution prepared from silver nitrate(AgNO 3)and ammonia as plating solution.The effects of AgNO 3 concentration and plating time on the morphology,conductivity and mechanical properties of metallized p-aramid fiber were studied.The deposition kinetics of silver(Ag)on the surface of p-aramid fiber was also discussed during electroless silver plating.The results showed that the favorable silver plating effect was acquired and the metallized p-aramid fiber was obtained with good electrical and mechanical properties through single variable experiment when the electroless plating temperature was 50℃,the AgNO 3 concentration 0.5 g/L and the plating time 50 min;the Ag layer was evenly distributed on the surface of metallized p-aramid fiber,the Ag grain size was 21.04 nm,the surface resistance of the fiber up to 1.5Ω/cm,the elongation at break 3.9%and the breaking strength 18.9 cN/dtex only 8.3%lower than that of the precursor without impacting the performance of the fiber;and the deposition rate of Ag on the surface of metallized p-aramid fiber decreased significantly and the weight gain rate increased gradually with the increase of plating time.
作者
蔡艳霞
陈兴刚
CAI Yanxia;CHEN Xinggang(0x09Hengshui University,Hengshui 053000;North China University of Science and Technology,Tangshan 063210)
出处
《合成纤维工业》
CAS
2020年第4期25-29,共5页
China Synthetic Fiber Industry
基金
河北省自然科学基金(E2019209514)
河北省高等学校科学技术研究项目(QN2020228)。
关键词
聚对苯二酰对苯二胺纤维
对位芳纶
金属化
化学镀银
导电性能
力学性能
poly-p-phenyleneterephthalamide fiber
p-aramid fiber
metallization
electroless silver plating
conductivity
mechanical properties