摘要
针对使用了H20E、84-1、8456和ME8456-DA四种导电胶的微波产品,采用气相清洗技术进行清洗试验。通过寿命测试和DSC等方法,探讨分析了该清洗技术与银颗粒-环氧导电胶的兼容性,以及对粘接强度和可靠性的影响,同时分析了溴丙烷清洗剂与导电胶的作用机理,提出了多芯片粘接件产品的清洗工艺和解决方案。
The vapor cleaning technique is used to test the clean effect of microwave components which use four kinds of conductive adhesive respectively:H20 E,84-1,8456 and ME8456-DA.By life test and differential scanning calorimeter(DSC),the analysis is discussed on compatibility between this clean technique and the epoxy conductive adhesive with silver particles,and impact on the bonding strength and the reliability quality.The mechanism of interaction between bromopropane cleaning agent and conductive adhesive epoxy resin is studied,hence the cleaning process for multi-chip products using conductive adhesive is put forward.
作者
张亚楠
孙鹏
张婷
ZHANG Yanan;SUN Peng;ZHANG Ting(Xi'an Institute of Space Radio Technology,Xi'an 710000,China)
出处
《电子工艺技术》
2019年第6期328-331,共4页
Electronics Process Technology
基金
国家自然科学基金(U1537104)
关键词
雾化清洗
银颗粒-环氧导电胶
粘接强度
可靠性
vapor cleaning
epoxy conductive adhesive with silver particles
bonding strength
reliability
