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Improvement of Electrical Performance of SOI-LIGBT by Resistive Field Plate

利用电阻场板提高SOI-LIGBT的性能(英文)
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摘要 The electrical performance including breakdown voltage and turn-off speed of SOI-LIGBT is improved by incorporating a resistive field plate (RFP) and a p-MOSFET.The p-MOSFET is controlled by a signal detected from a point of the RFP.During the turning-off of the IGBT,the p-MOSFET is turned on,which provides a channel for the excessive carriers to flow out of the drift region and prevents the carriers from being injected into the drift region.At the same time,the electric field affected by the RFP makes the excessive carriers flow through a wider region,which almost eliminates the second phase of the turning-off of the SOI-LIGBT caused by the substrate bias.Faster turn-off speed is achieved by above two factors.During the on state of the IGBT,the p-MOSFET is off,which leads to an on-state performance like normal one.At least,the increase of the breakdown voltage for 25% and the decrease of the turn-off time for 65% can be achieved by this structure as can be verified by the numerical simulation results. 通过在SOI LIGBT中引入电阻场板和一个p MOSFET结构 ,IGBT的性能得以大幅提高 .p MOSFET的栅信号由电阻场板分压得到 .在IGBT关断过程中 ,p MOSFET将被开启 ,作为阳极短路结构起作用 ,从而使漂移区的过剩载流子迅速消失 ,IGBT快速关断 .而且由于电场受到电阻场板的影响 ,使得过剩载流子能沿着一个更宽的通道流过漂移区 ,几乎消去了普通SOI LIGBT由于衬偏造成的关断的第二阶段 .这两个因素使得新结构的关断时间大大减少 .在IGBT的开启状态 ,由于p MOSFET不导通 ,因此器件的开启特性几乎与普通器件一致 .模拟结果表明 ,新结构至少能增加 2 5 %的耐压 ,减少 6 5 %的关断时间 .
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2002年第10期1014-1018,共5页 半导体学报(英文版)
基金 国家自然科学基金资助项目 (批准号 :6 9776 0 41)~~
关键词 resistive field plate dynamic controlled anode-short turn-off time breakdown voltage forward voltage drop SOI-LIGBT 电阻场板 动态控制阳极短路 关断时间 击穿电压 正向导通压降
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