摘要
为研究超声振动对单晶硅划片断面形貌形成机制的影响,建立了超声振动磨粒的运动轨迹方程,运用MATLAB软件对磨粒轨迹进行仿真。分别对单晶硅片进行径向振动旋转超声锯切和普通锯切,并对其断面形貌进行观察。结果表明:使用径向振动旋转超声锯切所产生的表面划痕为相互交错的波浪形,而普通锯切所产生的划痕为直线型,实验结果验证了磨粒运动轨迹理论分析的正确性。
In order to study the influence of ultrasonic vibration on the formation mechanism of the cross section of sawing monocrystalline silicon, the equation of cutting trace of abrasive grain in radial vibration rotary sawing process was presented, and the trace of abrasive grain was simu- lated using the MATLAB. The experiments of radial vibration rotary sawing and conventional sawing of monocrystalline silicon were carried out respectively. After sawing, the micrographs of the cross section surfaces were analyzed with SEM. The experimental results show that the scrat- ches on the cross section produced by ultrasonic assisted sawing present a crisscross wave path, while the straight line shaped path is produced in the conventional sawing process. And the simu- lated consequences are compared with the formation of cross section and their microstructures are found to be in the same manner, which proved the validity of this analytical method.
作者
沈剑云
朱旭
李政材
徐西鹏
SHEN Jianyun;ZHU Xu;LI Zhengcai;XU Xipeng(School of Mechanical Engineering and Automation, Huaqiao University, Xiamen 361021, Fujian, China)
出处
《陕西师范大学学报（自然科学版）》
CAS
CSCD
北大核心
2018年第3期21-25,共5页
Journal of Shaanxi Normal University：Natural Science Edition
基金
福建省高校产学合作项目(2018H6013)
福建省教育厅A类科技项目(JA13019)
关键词
径向振动锯切
单晶硅
磨粒轨迹
断面形貌
radial vibration rotary sawing
monocrystalline silicon
trace of abrasive grain
formation of cross section
