摘要
首先对X频段固态功率放大器(简称固放)的寿命进行了相关分析。针对高分三号(GF-3)卫星的在轨使用工况,分析出其寿命期内关键验证项目,并分别对设计试验进行验证。包含开关机电路的寿命分析及验证、大功率放大电路的寿命分析及验证、典型工艺的寿命分析及验证三个方面。其中大功率放大电路的寿命验证使用经典的Arrhenius模型,以热应力作为加速因子,进行加速验证。典型工艺选取导电胶粘接工艺,疲劳失效采用Confin-Manson模型进行分析验证。通过相关寿命试验验证,证明X频段10 W固放可以满足8年寿命要求。
In this paper,the factors influencing X-band solid state power amplifier（SSPA）life are analyzed.For the use of GF-3 satellites,the key validation items during its lifetime have been an-alyzed,then three tests are conducted to verity the switching circuit,microwave high-power cir-cuit and typical technology.The test for microwave high-power circuit used thermal stress as an acceleration element,the Arrhenius model had been used to calculate the acceleration factor.The conductive adhesive had been selected for the typical process and the Confin-Manson model had been used to analyze its reliability.Through thee relevant life tests,the domestic X-band 10W SSPA of more than 8 years life on-orbit had been proved.
出处
《航天器工程》
CSCD
北大核心
2017年第6期132-136,共5页
Spacecraft Engineering
基金
国家重大科技专项工程
