摘要
基于有限元方法,建立了小外形封装((Small Outline Package,SOP)三维模型,分析了热循环载荷下5种引脚结构对焊料变形和应力应变情况的影响,对互连可靠性进行了评估,并选取3种试验样件进行热循环试验,对数值模型进行了验证分析。试验和模拟结果均表明,引脚结构与封装互连可靠性密切相关,二次成型的引脚能够有效地降低焊料变形和应力水平,其中较小的弯曲半径、较高的引脚高度效果最优,数值计算和实物试验结果吻合,数值模型能够准确地反映产品的实际情况。
3-D finite element models of SOP（ Small Outline Package） were constructed,in which Anand visco-plasticity constitutive equation was used to describe the mechanic behavior of solder joint. The solder joint deformation and stress distribution with five kinds of lead shapes were researched. The experimental program for the identification of numerical simulation was performed with three kinds of lead shapes. Both experimental and simulation results showed that the solder joint life is closely related with lead shape. The lead shape with low stiffness can decrease the stress apparently. With decreasing the bending radius or increasing the standoff height,the component reliability will be enhanced. The numerical simulation result was congruous with experimental testing data,can able to reflect the factual behavior of SOP accurately.
出处
《机械强度》
CAS
CSCD
北大核心
2016年第3期591-595,共5页
Journal of Mechanical Strength
基金
航空基金(2014ZF41008)资助~~
关键词
引脚结构
有限元法
SOP
可靠性
Lead shape
Finite element method
Small outline package（SOP）
Reliability
