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Interfacial Microstructure and Mechanical Properties of Al Alloy/Mg Alloy Laminated Composite Plates Fabricated by Equal Channel Angular Processing 被引量:1

Interfacial Microstructure and Mechanical Properties of Al Alloy/Mg Alloy Laminated Composite Plates Fabricated by Equal Channel Angular Processing
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摘要 KAl(7075)alloy/Mg(AZ31)alloy laminated composite plates were successfully fabricated by the equalchannelangular processing(ECAP)by using route A for 1,2,and 3 passes at 573 K,respectively.After fabrication,the 1-pass ECAPed laminated composite plates were annealed at different temperatures.The microstructure evolution,phase constituent,and bonding strength near the joining interface of Al(7075)alloy/Mg(AZ31)alloy laminated composites plates were evaluated with scanning electron microscopy,X-ray diffraction,and shear tests.The experimentalresults indicated that a 20 μm diffusion layer was observed at the joining interface of Al(7075)alloy/Mg(AZ31)alloy laminated composites plates fabricated by the 1-pass ECAP,which mainly included Al_3Mg_2 and Mg_(17)Al_(12) phases.With the increase of passes,the increase of diffusion layer thickness was not obvious and the form of crack in these processes led to the decrease of bonding strength.For 1-pass ECAPed composites,the thickness of diffusion layer remained unchanged after annealed at 473 K,while the bonding strength reached its maximum value 29.12 MPa.However,after elevating heat treatment temperature to 573 K,the thickness of diffusion layer increased rapidly,and thus the bonding strength decreased. KAl(7075)alloy/Mg(AZ31)alloy laminated composite plates were successfully fabricated by the equalchannelangular processing(ECAP)by using route A for 1,2,and 3 passes at 573 K,respectively.After fabrication,the 1-pass ECAPed laminated composite plates were annealed at different temperatures.The microstructure evolution,phase constituent,and bonding strength near the joining interface of Al(7075)alloy/Mg(AZ31)alloy laminated composites plates were evaluated with scanning electron microscopy,X-ray diffraction,and shear tests.The experimentalresults indicated that a 20 μm diffusion layer was observed at the joining interface of Al(7075)alloy/Mg(AZ31)alloy laminated composites plates fabricated by the 1-pass ECAP,which mainly included Al_3Mg_2 and Mg_(17)Al_(12) phases.With the increase of passes,the increase of diffusion layer thickness was not obvious and the form of crack in these processes led to the decrease of bonding strength.For 1-pass ECAPed composites,the thickness of diffusion layer remained unchanged after annealed at 473 K,while the bonding strength reached its maximum value 29.12 MPa.However,after elevating heat treatment temperature to 573 K,the thickness of diffusion layer increased rapidly,and thus the bonding strength decreased.
出处 《Journal of Wuhan University of Technology(Materials Science)》 SCIE EI CAS 2016年第2期417-421,共5页 武汉理工大学学报(材料科学英文版)
基金 Funded by the National Natural Science Foundations of China(No.51301118) the Projects of International Cooperation in Shanxi(2014081002) the Scientific and Technological Innovation Programs of Higher Education Institutions in Shanxi(2013108)
关键词 laminated composite interface microstructure bonding ECAP laminated composite interface microstructure bonding ECAP
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