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随机振动下板级组件焊点可靠性研究进展 被引量：7

Research development on the reliability of board level assembly solder joint under random vibration
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摘要 针对板级组件焊点在随机振动下的可靠性问题,对与之相关的实验研究成果和仿真结果进行了综述。首先介绍了球栅阵列(BGA)封装芯片焊点失效的位置,BGA焊点的材料以及BGA参数和印制电路板(PCB)参数对焊点可靠性的分析,并介绍了疲劳寿命预测方法和子模型法、特殊结构的随机振动分析。最后,提出了随机振动情况下的BGA结构的优化方法。 Aimed at the reliability of board-level assembly solder joint under random vibration, the experimental results and simulation results related to the reliability issues are summarized. Firstly, the failure position of the ball grid array （BGA） solder joint, the material of the BGA solder joint and the parameter of BGA and the parameter of printed circuit board （PCB） which influence the reliability of the solder joint are introduced. Then fatigue life prediction method and the Sub-model method, the random vibration analysis of special structure are described. Finally, the optimization method of BGA is proposed.
作者 刘培生 刘亚鸿 杨龙龙 卢颖 王浩
机构地区 南通大学江苏省专用集成电路设计重点试验室
出处 《电子元件与材料》 CAS CSCD 2015年第11期5-10,共6页 Electronic Components And Materials
关键词 焊点 随机振动 综述 有限元分析 失效 可靠性 板级组件 solder joint random vibration review finite element analysis failure reliability board level assembly
分类号 TN43 [电子电信—微电子学与固体电子学]
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参考文献37

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二级参考文献80

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共引文献43

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引证文献7

二级引证文献7

电子元件与材料
2015年 第11期

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