摘要
介绍了填充型导热环氧树脂复合材料的导热机理,综述了近几年国内外的最新研究进展,提出了目前该类导热复合材料面临的问题,并对其发展方向进行了展望。
The thermal conducting mechanism of the thermal conductive composites based on filled epoxy resins was introduced, the recent progress in the composites at home and abroad was summarized, the existed problems for the thermal conductive materials were pointed out, and their development directions were also looked forward.
出处
《粘接》
CAS
2015年第4期83-86,82,共5页
Adhesion
基金
广东省教育部产学研结合项目(2012B091100067)
关键词
环氧树脂
导热填料
研究进展
发展方向
epoxy resin
thermal conductive filler
progress
development direction
