摘要
采用电沉积(ED)方法在铜基上制得了由微球和微孔构成的微米级粗糙表面,用过硫酸钾和氢氧化钠的混合溶液处理后,在镀层上形成了Cu(OH)2纳米条/CuO微球的微纳米粗糙结构,再经过氟硅烷修饰得到超疏水表面。表面的静态接触角(CA)最大达到了158.5°。在3.5%(wt)的NaCl溶液中用三电极体系测得了实验制备的超疏水表面的极化曲线,腐蚀电位比光滑铜表面正移了23 mV,腐蚀电流降低了2个数量级,缓蚀效率高达97.7%。为超疏水表面的实用性探索提供基础。
A rough microstructural surface which consists of microspheres and microvoids was prepared by electrodeposition （ED） on copper substrate, and then oxidized by an aqueous solution of NaOH and K2S2O8. A hierarchical structure of CuO microspheres and Cu（OH）2 nanorod arrays is fabricated on the plating, and the surface with hierarchical structure finally possesses superhydrophobicity after chemical modification with fluoroalkylsilane（FAS）. The static contact angles for water on the copper plating film are up to 158.5＆#176;. The corrosion inhibition property of superhydrophobic film in 3.5%（wt） NaCl solution was examined by polarization curve measurement, and results show that, comparing with smooth copper surface, the free corrosion potential of the superhydrophobic film is shifted positively by 23 mV, the corrosion current density is decreased by 2 orders of magnitude and its inhibition efficiency is up to 97.7%. This work provides fundamental knowledge for the applications of superhydrophobic surfaces.
出处
《高校化学工程学报》
EI
CAS
CSCD
北大核心
2014年第5期1178-1182,共5页
Journal of Chemical Engineering of Chinese Universities
基金
国家自然科学基金(20476014
51376030)
关键词
电沉积
超疏水
接触角
极化曲线
electrodeposition
superhydrophobicity
contact angle
polarization curve
