摘要
含铜电镀废水中酒石酸等络合剂的存在,使得采用普通氢氧化物或硫化物沉淀法难以满足达标排放的要求。采用UV/H2O2-NaOH沉淀法处理铜-酒石酸络合体系模拟电镀废水,考察了光照时间、初始pH、H2O2投加量等因素对处理过程的影响。结果表明,对于铜-酒石酸络合体系(酒石酸质量浓度为418mg/L,CuSO4·5H2O质量浓度为196mg/L),得出的最佳处理条件为:光照时间70min,H2O2投加量1.07g/L,初始pH 3.0,出水中铜质量浓度可以低于0.3mg/L的排放标准,为后续工业化应用奠定了基础。
Due to the existence of tartaric acid,the copper in electroplating wastewater was hard to meet the strict discharge standard after treated by common chemistry precipitation method.In order to solve the problem,the chelated compound of tartaric acid-copper solution （concentration of tartaric acid=418 mg/L,concentration of CuSO4 · 5 H2 O=196 mg/L） was used to simulate the electroplating wastewater and then treated by UV/H2O2-NaOH precipitation method,the effect of irradiation time,H2O2 dosage and initial pH on treatment efficiency was investigated.Results showed that the optimum treatment conditions were 1.07 g/L of H2O2,initial pH of 3.0,and irradiation for 70 min,under these conditions,the effluent copper fell below 0.3 mg/L.This method proves the effectiveness to deal with this kind of wastewater so that it can provide theoretical instructions for the practical application.
出处
《环境污染与防治》
CAS
CSCD
北大核心
2014年第12期69-72,共4页
Environmental Pollution & Control
基金
上海重金属污染防治与资源化工程技术研究中心课题(No.11DZ2282600)
