摘要
随着电子元器件向着微型化的方向发展,线路板BGA(球栅阵列)区域间距大小也从0.80 mm发展到0.40 mm,这要求更高的层压对位精度,文章通过研究层压芯板叠层与其受力的规律,在现有设备工艺条件下,把层压对位精度大幅提升至0.038 mm。
Because of the electronic components becoming miniature, BGA pitch of the circuit boards changes from 0.80mm to 0.40mm, which requires better alignment accuracy in lamination. By researching the lamination of the core and its rules of the compressive stress, this paper improves lamination alignment accuracy to 1.5 mil without changing the equipments and process conditions presently existed.
出处
《印制电路信息》
2014年第7期30-31,70,共3页
Printed Circuit Information
关键词
层压对位精度
平整性
受力均匀
Laminated Alignment Accuracy
Flatness
Uniform Stress
