摘要
如何简单、快速且低成本制备穿通导线一直是基于玻璃通孔的微机械传感器晶圆级真空封装的技术难点。根据电化学反应理论,设计了一种有掩膜电镀的穿通导线制备方法。采用纳秒激光烧灼得到玻璃通孔,利用掩膜增大电镀时通孔周围的电流密度,实现了任意尺寸玻璃通孔的快速金属填充。实验分析确定300?m厚的玻璃最优通孔直径为100?m,通孔间的电阻均约为0.347?,最大误差为2.59%。通过沿通孔划片得到的扫描电子显微镜下图像可以看出,金属填充致密均匀,形貌良好。
The simple,rapid and low-cost preparation of the through wire is a technical difficulty for the wafer level vacuum packaging of MEMS sensor based on through-glass-via (TGA).A preparation method of the through wire with masked plating is designed based on electrochemical reaction theory.The ablated TGA is obtained by nanosecond laser burning,and the current density around the TGA is increased by the mask, which realizes the rapid metal filling of the TGA with any size.Experimental results show that the optimum TGA diameter is 100μm for 300μm thick glass.The resistances between the TGAs are all about 0.347Ω and have a maximum error of 2.59%.It can be seen from the scanning electron microscope image obtained by cutting along the TGA that the metal filling has compact uniform and good morphology.
作者
石云波
赵思晗
赵永祺
李飞
焦静静
李志强
SHI Yunbo;ZHAO Sihan;ZHAO Yongqi;LI Fei;JIAO Jingjing;LI Zhiqiang(Science and Technology on Electronic Test &Measurement Laboratory,North University of China,Taiyuan 030051,China)
出处
《中国惯性技术学报》
EI
CSCD
北大核心
2018年第5期660-664,共5页
Journal of Chinese Inertial Technology
基金
国家自然科学基金青年科学基金项目(51705477)
毁伤技术国防重点学科实验室开放基金(DXMBJJ2017-15)
电子测试技术重点实验室稳定支持经费项目资助(WD614200104011804)
