摘要
讨论微电子机械系统 (MEMS)的三个力学问题 :( 1)微系统界面区域的力学性质。 ( 2 )薄膜—基底结构界面的裂纹扩展。 ( 3)微机械的弹塑性—粘着接触力学。文中在简述了研究现状后 ,简要地报导了作者及其合作者对上述三个问题的研究结果。
Three problems of solid mechanics for micro-electro-mechanical systems are discussed: (1) Mechanical behavior of interfacial region for the components of microsystem: By using the strain gradient theory, the theoretical analysis shows the existence of boundary layer near interfaces and the significance of strain gradient effects on interfacial deformation. (2) Crack growth on the interface of thin film/substrate structures: the residual stress in the film induced by the mechanical and thermal mismatch in the manufacture is an important cause of initialization and extension of interface crack. The modified three parameters (Γ0, σ/σs, t) cohesive model was used to investigate the cleavage fracture under outer plastic deformation fields. A typical resistance curves have been calculated by using finite element method. (3) Elastic-plastic contact mechanics considering adhesive effects: A non-linear spring element has been used to simulate the adhesive force. Through specific quantitative analysis, two parameters of the adhesive force (Γ0, σ) are adopted. After a simple review on the research status in the topics shown above, some new results for three problems are presented.
出处
《机械强度》
EI
CAS
CSCD
北大核心
2001年第4期380-384,共5页
Journal of Mechanical Strength
基金
国家自然科学基金资助项目 (1 0 1 72 0 50 )
关键词
微电子机械系统
办学界面
薄膜基底结构
弹塑性-粘着接触力学
裂纹扩展
Micro electro mechanical system
Interface (Interphase) mechanics
Thin film/substrate structure
Elastic plastic adhesive contact mechanics
